Hardware
Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users (Marco Chiappetta/Forbes)
Marco Chiappetta / Forbes: Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users — As systems
Marco Chiappetta / Forbes: Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users — As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.
Source: Techmeme | 2026-07-15