Applications
TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters)
Reuters: TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun — Taiwan Semiconductor Manufacturing Co (2330.TW) plans
Reuters: TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun — Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.
Related
- SK Hynix says it plans to invest ~$12.85B in a new fab in South Korea for advanced packaging to meet AI demand for HBM, with construction starting this month (Reuters)
- TSMC says it will hold off on using ASML's most advanced high-NA EUV machines, costing upwards of €350M apiece, for chip production through 2029 to save money (Bloomberg)
- TSMC reports Q1 revenue up 35.1% YoY to ~35B, net income up 58.3% YoY to ~18B, both above est., and says 7nm or smaller chips were ~74% of its wafer revenue (Dylan Butts/CNBC)
- Data center, consumer device chips boost TSMC’s revenue
- TSMC unveils its process technology roadmap through 2029, aiming to launch a new node yearly for client applications and every two years for AI and HPC (Anton Shilov/Tom's Hardware)
Source: Techmeme | 2026-04-23