Applications
Microsoft unveils its third-gen in-house AI chip, the Maia 300, built on TSMC's N2P process node and aimed at serving as its 'primary AI inference system' (Tom Warren/The Verge)
Tom Warren / The Verge: Microsoft unveils its third-gen in-house AI chip, the Maia 300, built on TSMC's N2P process node and aimed at serving as its “primary AI inference system” — The new Maia 300 ch
Tom Warren / The Verge: Microsoft unveils its third-gen in-house AI chip, the Maia 300, built on TSMC's N2P process node and aimed at serving as its “primary AI inference system” — The new Maia 300 chip will start rolling out to production AI workloads in 2027.
Related
- TSMC unveils its process technology roadmap through 2029, aiming to launch a new node yearly for client applications and every two years for AI and HPC (Anton Shilov/Tom's Hardware)
- TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters)
- Sources: OpenAI and Broadcom discuss terms for Broadcom to finance initial custom chip production for ~$18B, conditioned on Microsoft buying ~40% of the chips (Anissa Gardizy/The Information)
Source: Techmeme | 2026-10-12