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On the Importance of Geometric Nonlinearity and Temperature-Dependent Properties in Multi-Material Thermo-Mechanical Topology Optimization
arXiv:2608.10344v1 Announce Type: cross Abstract: Thermo-mechanical compliant devices are commonly designed with small-strain linear elasticity and temperature-independent material properties, even th
arXiv:2608.10344v1 Announce Type: cross Abstract: Thermo-mechanical compliant devices are commonly designed with small-strain linear elasticity and temperature-independent material properties, even though they might operate hundreds of kelvin above ambient where both assumptions are questionable. In this work, we quantify the effect and cost of each assumption in multi-material topology optimization of thermally actuated compliant devices. To this end, we introduce a physics-informed, simultaneous analysis-and-design framework with (i) a finite-strain quadratic-Hencky (logarithmic-strain) constitutive model whose isotropic thermal eigenstrain admits an exact additive split in log-strain space, and (ii) temperature-dependent conductivity, thermal expansion, and elastic moduli for a titanium--copper--steel material system. We optimize a thermal actuator and a thermal gripper at three design temperatures under both a baseline model and the full physics, subject to mass and manufacturability constraints. Every converged design is re-evaluated by verified nonlinear finite element solvers in the full factorial of constitutive law and property model. The comparison between the two factors reveals that the constitutive law is the decisive modeling choice: These devices work as linkages where linear kinematics mistakes rotation for compressive strain; its error therefore grows with the design temperature and concentrates on the very layouts that exploit rotation best. Because a linear optimizer also steers away from the rotation-rich mechanisms that would expose this bias, the model can deceptively appear trustworthy when validated against its own designs. Designing with the full physics yields consistently stronger and more temperature-robust devices at a modest increase in design-time cost.
Source: arXiv cs.LG | 2026-08-12